A benchmark study of computational fluid dynamics predictive accuracy for component-printed circuit board heat transfer

Chemical Engineering

• Heat Transfer 100%
• Thermal Conductivity 50%
• Natural Convection 50%
• Forced Convection 50%
• Heat Convection 50%
• Fluid Flow 50%
• Energy Balance 50%
• Film 50%

Material Science

• Electronic Circuit 100%
• Computational Fluid Dynamics 100%
• Transfer Process 40%
• Thermal Conductivity 20%
• Fluid Flow 20%
• Film 20%
• Forced Convection 20%
• Natural Convection 20%
• Dynamic Analysis 20%
• Surface (Surface Science) 20%

Engineering

• Heat Transfer 40%