Comparison and validation of experimental techniques to measure electronic component operating junction temperature

Increasing power densities and changing component design have brought about the need for accurate measurement of die junction temperature. While many different techniques exist it is difficult to compare their relative performance. To validate the accuracy of various direct and indirect test methods, the operating junction temperature of board-mounted SO16 and PQFP160 devices has been recorded using standard thermal test die. Numerical analysis was also used to predict junction temperature and package temperature gradients. The performance of each technique is evaluated for accuracy, ease of use and relevance to real applications.