TY - JOUR
T1 - Effect of both PCB thermal conductivity and nature of forced convection environment on component operating temperature
T2 - Experimental measurement and numerical prediction
AU - Lohan, John
AU - Tiilikka, Pekka
AU - Fager, Carl Magnus
AU - Rantala, Jukka
PY - 2000
Y1 - 2000
N2 - The steady state thermal performance of two package types is characterized on up to four different thermal test printed circuit boards (PCBs) operating within two different forced convection environments. Both standard and non-standard test PCBs and test environments were used so that component thermal performance under standard test conditions could be compared with that measured under non-standard conditions that mimics those found in service. The design of the test boards spanned from the low and high conductivity JEDEC standard, FR4 test PCBs to typical eight-layer application boards, whereas forced convection airflows were generated by both a wind tunnel, representing the standard test environment, and upstream axial fans.
AB - The steady state thermal performance of two package types is characterized on up to four different thermal test printed circuit boards (PCBs) operating within two different forced convection environments. Both standard and non-standard test PCBs and test environments were used so that component thermal performance under standard test conditions could be compared with that measured under non-standard conditions that mimics those found in service. The design of the test boards spanned from the low and high conductivity JEDEC standard, FR4 test PCBs to typical eight-layer application boards, whereas forced convection airflows were generated by both a wind tunnel, representing the standard test environment, and upstream axial fans.
UR - http://www.scopus.com/inward/record.url?scp=0033750705&partnerID=8YFLogxK
U2 - 10.1109/STHERM.2000.837075
DO - 10.1109/STHERM.2000.837075
M3 - Article
AN - SCOPUS:0033750705
SN - 1065-2221
SP - 128
EP - 139
JO - Annual IEEE Semiconductor Thermal Measurement and Management Symposium
JF - Annual IEEE Semiconductor Thermal Measurement and Management Symposium
ER -