Effect of both PCB thermal conductivity and nature of forced convection environment on component operating temperature: Experimental measurement and numerical prediction

The steady state thermal performance of two package types is characterized on up to four different thermal test printed circuit boards (PCBs) operating within two different forced convection environments. Both standard and non-standard test PCBs and test environments were used so that component thermal performance under standard test conditions could be compared with that measured under non-standard conditions that mimics those found in service. The design of the test boards spanned from the low and high conductivity JEDEC standard, FR4 test PCBs to typical eight-layer application boards, whereas forced convection airflows were generated by both a wind tunnel, representing the standard test environment, and upstream axial fans.