TY - JOUR
T1 - Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint
AU - Bashir, M. Nasir
AU - Saad, Hafiz Muhammad
AU - Rizwan, Muhammad
AU - Quazi, M. M.
AU - Ali, Muhammad Mahmood
AU - Ahmed, Arslan
AU - Zaidi, Asad A.
AU - Soudagar, Manzoore Elahi M.
AU - Haseeb, A. S.M.A.
AU - Naher, Sumsun
N1 - Publisher Copyright:
© 2022, The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature.
PY - 2022/10
Y1 - 2022/10
N2 - Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting point, reliability and high tensile strength. The presence of the bismuth-rich phase increases the brittleness of Sn-58Bi alloy. The purpose of this study is to suppress the brittleness of Sn-58Bi alloy by the addition of different wt% (0, 10, 20, 30) of Sn powder. The powder metallurgy method was used to prepare the samples. Scanning electron microscopy and energy-dispersive X-ray analysis were done to study the structural properties and a tensile test was done by a universal tensile machine to study the mechanical properties. The results reveal that the Sn particles partially dissolved in the Sn-58Bi solder matrix. The dissolution of Sn particles significantly improved the mechanical strength by 30%, suppressed the brittleness and improved the strain value by 1.3 times.
AB - Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting point, reliability and high tensile strength. The presence of the bismuth-rich phase increases the brittleness of Sn-58Bi alloy. The purpose of this study is to suppress the brittleness of Sn-58Bi alloy by the addition of different wt% (0, 10, 20, 30) of Sn powder. The powder metallurgy method was used to prepare the samples. Scanning electron microscopy and energy-dispersive X-ray analysis were done to study the structural properties and a tensile test was done by a universal tensile machine to study the mechanical properties. The results reveal that the Sn particles partially dissolved in the Sn-58Bi solder matrix. The dissolution of Sn particles significantly improved the mechanical strength by 30%, suppressed the brittleness and improved the strain value by 1.3 times.
UR - http://www.scopus.com/inward/record.url?scp=85138316599&partnerID=8YFLogxK
U2 - 10.1007/s10854-022-09028-5
DO - 10.1007/s10854-022-09028-5
M3 - Article
AN - SCOPUS:85138316599
SN - 0957-4522
VL - 33
SP - 22499
EP - 22507
JO - Journal of Materials Science: Materials in Electronics
JF - Journal of Materials Science: Materials in Electronics
IS - 28
ER -