Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on SiO<inf>2</inf> substrates

J.G. Lozano, S. Lozano-Perez, J. Bogan, Y.C. Wang, B. Brennan, P.D. Nellist, GJ Hughes

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title = "Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on SiO2 substrates",

author = "J.G. Lozano and S. Lozano-Perez and J. Bogan and Y.C. Wang and B. Brennan and P.D. Nellist and GJ Hughes",

year = "2011",

doi = "10.1063/1.3569146",

language = "Undefined/Unknown",

journal = "Applied Physics Letters",

issn = "0003-6951",

publisher = "AIP Publishing",

}

TY - JOUR

T1 - Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on SiO2 substrates

AU - Lozano, J.G.

AU - Lozano-Perez, S.

AU - Bogan, J.

AU - Wang, Y.C.

AU - Brennan, B.

AU - Nellist, P.D.

AU - Hughes, GJ

PY - 2011

Y1 - 2011

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-79953869868&partnerID=MN8TOARS

U2 - 10.1063/1.3569146

DO - 10.1063/1.3569146

M3 - Article

SN - 0003-6951

JO - Applied Physics Letters

JF - Applied Physics Letters

ER -