Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on SiO<inf>2</inf> substrates

Research output: Contribution to journal › Article › peer-review

42 Citations (Scopus)

Access to Document

@article{55d5a326da1c40968f260a24de453d85,

title = "Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on SiO2 substrates",

author = "J.G. Lozano and S. Lozano-Perez and J. Bogan and Y.C. Wang and B. Brennan and P.D. Nellist and GJ Hughes",

year = "2011",

doi = "10.1063/1.3569146",

language = "Undefined/Unknown",

journal = "Applied Physics Letters",

issn = "0003-6951",

publisher = "AIP Publishing",

}

TY - JOUR

T1 - Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on SiO2 substrates

AU - Lozano, J.G.

AU - Lozano-Perez, S.

AU - Bogan, J.

AU - Wang, Y.C.

AU - Brennan, B.

AU - Nellist, P.D.

AU - Hughes, GJ

PY - 2011

Y1 - 2011

UR - https://www.scopus.com/pages/publications/79953869868

U2 - 10.1063/1.3569146

DO - 10.1063/1.3569146

M3 - Article

SN - 0003-6951

JO - Applied Physics Letters

JF - Applied Physics Letters

ER -