Abstract
This article presents a radiation-hardened-by-process 56-Gb/s electro-absorption modulator (EAM) driverdesigned in a 130-nm silicon germanium (SiGe) bipolar comple-mentary metal oxide semiconductor (BiCMOS) technology forapplication in optical intrasatellite links. Details of the driverarchitecture are provided, along with the electrical and opticalmeasurement setups used to evaluate its performance. To assessthe vulnerability of the driver against radiation exposure in thespace environment, samples were irradiated with X-rays up toa total accumulated dose of 1.2 Mrad(Si), simulating the effectsof total ionizing dose (TID) in orbit. Furthermore, heavy-ionexperiments corroborated the driver’s resilience to single-eventtransients (SETs) across a range of linear energy transfers (LETs)from 20 to 65.2 MeV cm2/mg, with a particle fluence of 1.2 ×107 cm−2. No single-event latchup (SEL) was observed in theirradiated samples during the heavy-ion exposure.
| Original language | English |
|---|---|
| Pages (from-to) | 1228-1236 |
| Number of pages | 9 |
| Journal | IEEE Transactions on Nuclear Science |
| Volume | 72 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 2025 |
| Externally published | Yes |
Keywords
- Analog integrated circuit (IC) design
- optical transmitters
- radiation effects
- radiation hardening by process
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