(S) TEM analysis of the interdiffusion and barrier layer formation in Mn/Cu heterostructures on SiO2 for interconnect technologies

JG Lozano, S Lozano-Perez, J Bogan, YC Wang, B Brennan, PD Nellist, GJ Hughes

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Journal of Physics: Conference Series
Pages	012037
Number of pages	1
Volume	371
Publication status	Published - 2012

Cite this

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title = "(S) TEM analysis of the interdiffusion and barrier layer formation in Mn/Cu heterostructures on SiO2 for interconnect technologies",

author = "JG Lozano and S Lozano-Perez and J Bogan and YC Wang and B Brennan and PD Nellist and GJ Hughes",

year = "2012",

language = "Undefined/Unknown",

volume = "371",

pages = "012037",

booktitle = "Journal of Physics: Conference Series",

}

TY - GEN

T1 - (S) TEM analysis of the interdiffusion and barrier layer formation in Mn/Cu heterostructures on SiO2 for interconnect technologies

AU - Lozano, JG

AU - Lozano-Perez, S

AU - Bogan, J

AU - Wang, YC

AU - Brennan, B

AU - Nellist, PD

AU - Hughes, GJ

PY - 2012

Y1 - 2012

M3 - Conference contribution

VL - 371

SP - 012037

BT - Journal of Physics: Conference Series

ER -