TY - JOUR
T1 - Thermal challenges in next generation electronic systems- Summary of panel presentations and discussions
AU - Garimella, Suresh V.
AU - Joshi, Yogendra K.
AU - Bar-Cohen, Avram
AU - Mahajan, Ravi
AU - Toh, K. C.
AU - Carey, V. P.
AU - Baelmans, M.
AU - Lohan, J.
AU - Sammakia, B.
AU - Andros, F.
PY - 2002/12
Y1 - 2002/12
N2 - The presentations made, as well as the discussions, in the panels at the workshop, Thermal Challenges in Next Generation Electronic Systems (THERMES), are summarized in this paper. The panels dealt with diverse topics including thermal management roadmaps, microscale cooling systems, numerical modeling from the component to system levels, hardware for future high performance and internet computing architectures, and transport issues in the manufacturing of electronic packages. The focus of the panels was to identify barriers to further progress in each area that require the attention of the research community.
AB - The presentations made, as well as the discussions, in the panels at the workshop, Thermal Challenges in Next Generation Electronic Systems (THERMES), are summarized in this paper. The panels dealt with diverse topics including thermal management roadmaps, microscale cooling systems, numerical modeling from the component to system levels, hardware for future high performance and internet computing architectures, and transport issues in the manufacturing of electronic packages. The focus of the panels was to identify barriers to further progress in each area that require the attention of the research community.
UR - http://www.scopus.com/inward/record.url?scp=0037002435&partnerID=8YFLogxK
U2 - 10.1109/TCAPT.2003.809113
DO - 10.1109/TCAPT.2003.809113
M3 - Article
AN - SCOPUS:0037002435
SN - 1521-3331
VL - 25
SP - 569
EP - 575
JO - IEEE Transactions on Components and Packaging Technologies
JF - IEEE Transactions on Components and Packaging Technologies
IS - 4
ER -