TY - JOUR
T1 - Time of flight secondary ion mass spectrometry imaging of contaminant species in chemical vapour deposited graphene on copper
AU - Brennan, Barry
AU - Veigang-Radulescu, Vlad-Petru
AU - Braeuninger-Weimer, Philipp
AU - Hofmann, Stephan
AU - Pollard, Andrew J
N1 - Publisher Copyright:
© 2026 Brennan et al.; licensee Beilstein-Institut. License and terms: This is an open access article licensed under the terms of the Beilstein-Institut Open Access License Agreement (https://www.beilstein-journals.org/bjnano/terms), which is identical to the Creative Commons Attribution 4.0 International License (https://creativecommons.org/licenses/by/4.0). The reuse of material under this license requires that the author(s), source and license are credited. Third-party material in this article could be subject to other licenses (typically indicated in the credit line), and in this case, users are required to obtain permission from the license holder to reuse the material.
PY - 2026/1/21
Y1 - 2026/1/21
N2 - Time of flight secondary ion mass spectrometry (ToF-SIMS) was used to probe the chemistry of graphene grown on copper foil substrates by chemical vapour deposition (CVD) under various growth conditions. The surface sensitivity, mass resolving power, and imaging capability of ToF-SIMS allow us to explore variations in the chemical species present on the graphene surface, as well as in three dimensions under the graphene. In this way, we can observe the impact that variations in the chemical composition of the copper foil have on the growth of the graphene; in particular, the accumulation of contaminations present in the copper foil, which has implications for the potential electrical properties of the graphene. We also observe variations in the permeation of oxygen underneath the graphene layers, resulting in oxidation of the copper substrate, depending on processing conditions employed and the chemical species present on the surface. This has implications for the gas permeation barrier properties of this material, graphene transfer mechanisms, as well as the effectiveness of using the oxidation of the copper foil as a rapid graphene quality control method. These results highlight the significance of understanding the role of trace contaminants and elemental distributions within the catalyst in conjunction with growth parameters for optimised CVD of graphene layers.
AB - Time of flight secondary ion mass spectrometry (ToF-SIMS) was used to probe the chemistry of graphene grown on copper foil substrates by chemical vapour deposition (CVD) under various growth conditions. The surface sensitivity, mass resolving power, and imaging capability of ToF-SIMS allow us to explore variations in the chemical species present on the graphene surface, as well as in three dimensions under the graphene. In this way, we can observe the impact that variations in the chemical composition of the copper foil have on the growth of the graphene; in particular, the accumulation of contaminations present in the copper foil, which has implications for the potential electrical properties of the graphene. We also observe variations in the permeation of oxygen underneath the graphene layers, resulting in oxidation of the copper substrate, depending on processing conditions employed and the chemical species present on the surface. This has implications for the gas permeation barrier properties of this material, graphene transfer mechanisms, as well as the effectiveness of using the oxidation of the copper foil as a rapid graphene quality control method. These results highlight the significance of understanding the role of trace contaminants and elemental distributions within the catalyst in conjunction with growth parameters for optimised CVD of graphene layers.
KW - CVD
KW - ToF-SIMS
KW - contamination
KW - copper
KW - graphene
UR - https://www.scopus.com/pages/publications/105032524821
U2 - 10.3762/bjnano.17.13
DO - 10.3762/bjnano.17.13
M3 - Article
VL - 17
SP - 200
EP - 213
JO - Beilstein Journal of Nanotechnology
JF - Beilstein Journal of Nanotechnology
IS - 13
ER -